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China Wholesaler Thermal Conductive Silicone Adhesives

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China Wholesaler Thermal Conductive Silicone Adhesives

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Brand Name : Ziitek

Model Number : TIS580-12

Certification : RoHS

Place of Origin : China

MOQ : 10kg

Price : 1-100USD/KG

Payment Terms : T/T

Supply Ability : 10000kg/month

Delivery Time : 3-8 work days

Packaging Details : 1kg/can

material : silicone adhesive

keyword : Thermal Conductive Silicone Adhesives

total cure time : 3-7 days (25℃)

hardness : 25(Shore A)

name : thermally conductive silicone adhesive

feature : dealcoholized, 1 component, room temperature cure

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China Wholesaler Thermal Conductive Silicone Adhesives

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.

TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

TIS580-12 Series Datasheet-(E)-REV01.pdf

Feature

> Good thermal conductivity: 1.2W/mK

> Good maneuverability and good adhesion

> Low shrinkage

> Low viscosity, leads to void-free surface

> Good solvent resistance, water resistance

> Longer working life

> Excellent thermal shock resistance

Application

It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-12, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers

Typical values of TISTM580-12

Appearance White paste Test Method
Density(g/cm3,25℃) 1.2 ASTM D297
Tack-free time(min,25℃) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25℃ Brookfield (Uncured) 5000 cps ASTM D1084
Total cure time(d, 25℃) 3-7 *****
Elongation(%) ≥150 ASTM D412
Hardness(Shore A) 25 ASTM D2240
Lap Shear Strength(MPa) ≥2.0 ASTM D1876
Peel Strength(N/mm) >3.5 ASTM D1876
Operation temperature(℃) -60~250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 1.2 ASTM D5470
Flame Retardancy UL94 V-0 E331100

Package:
300ml/tube
China Wholesaler Thermal Conductive Silicone Adhesives

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract.


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